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Home > PRODUCTS > Sputtering SystemSputtering System
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“SPUTTERING” is a vacuum process used to deposit very thin films on substrates.
We provide Sputtering Coating Systems.
The models are classified according to the functions and specifications of the product.
AR/AF Sputtering System
Benefits
AR/AF coating by sputtering
Substrate cleaning by LIS
High density / Uniformity
High deposition rate
Process stability
Easy replacement target
Plasma
Chamber wall
| Description | Specification | |
|---|---|---|
| Process Chamber | Process chamber |
Vertical type Material : STS304 Size : Ø1650mm x 1840mm |
| Substrate rotation & carrier | Rotation | Rotational type : Revolution and rotation |
| Exhausting system | HV Pump | Turbo pump |
| LV Pump | Dry pump | |
| Vacuum gauge | Pirani gauge | Low Vac Range :760torr ~ 3×E-4torr |
| Ion gauge | High Vac Range :8×E-3 ~ 3×E-9torr | |
| Cooling system | Polycold | Cold chiller |
| Heating system | Outgasing purpose | |
| Processing gas Control | M.F.C |
MFC(N2,O2 100sccm) APC : needle valve |
| Source | Cylinderical Target |
Dual cylindrical target Thickness: 10mmT |
| Sputter source | End Block |
Power : up to 100kw DC or 80kw MF/AC V/A : 1000V/225A |
| Magnet | 70%↑ target Utilization, ±5% Uniformity | |
| Ion Source | Linear type |
100mm(W) × 1,400mm(H) 10kw, Ar,O2 /500sccm |
| Thermal source | Center pole | 30kw |
| Electric /Control | Electric power | 3ph 220V/440V 60Hz |
| Control | PC(HMI)+PLC(I/O) Programming | |
- AProcessing Chamber
- BSystem Controller
- CHigh vacuum pump
- DLow vacuum pump
- EWater vapor cryocooler
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