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“SPUTTERING” is a vacuum process used to deposit very thin films on substrates.
We provide Sputtering Coating Systems.
The models are classified according to the functions and specifications of the product.
AR/AF coating by sputtering
Substrate cleaning by LIS
High density / Uniformity
High deposition rate
Process stability
Easy replacement target
Description | Specification | |
---|---|---|
Process Chamber | Process chamber |
Vertical type Material : STS304 Size : Ø1650mm x 1840mm |
Substrate rotation & carrier | Rotation | Rotational type : Revolution and rotation |
Exhausting system | HV Pump | Turbo pump |
LV Pump | Dry pump | |
Vacuum gauge | Pirani gauge | Low Vac Range :760torr ~ 3×E-4torr |
Ion gauge | High Vac Range :8×E-3 ~ 3×E-9torr | |
Cooling system | Polycold | Cold chiller |
Heating system | Outgasing purpose | |
Processing gas Control | M.F.C |
MFC(N2,O2 100sccm) APC : needle valve |
Source | Cylinderical Target |
Dual cylindrical target Thickness: 10mmT |
Sputter source | End Block |
Power : up to 100kw DC or 80kw MF/AC V/A : 1000V/225A |
Magnet | 70%↑ target Utilization, ±5% Uniformity | |
Ion Source | Linear type |
100mm(W) × 1,400mm(H) 10kw, Ar,O2 /500sccm |
Thermal source | Center pole | 30kw |
Electric /Control | Electric power | 3ph 220V/440V 60Hz |
Control | PC(HMI)+PLC(I/O) Programming |
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